Advanced Packaging

Advanced Packaging

4.11 - 1251 ratings - Source

Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.Luc van den Hove, executive V.P. and COO of IMEC, says both Replisaurus and S.E.T. technologies are interesting for advanced packaging applications, and that S.E.T.a#39;s FC300 device bonder system will help complete IMECa#39;s program.

Title:Advanced Packaging
Publisher: - 2009-01


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