An experimental study was conducted to investigate the effects of lead-free processing on key thermomechanical, physical, and chemical properties of a range of FR-4 PCB laminate materials. The laminate material properties were measured as per the IPC/UL test methods before and after subjecting to multiple lead-free soldering cycles.Printed circuit boards (PCBs) are the baseline in electronic packaging upon which electronic components are formed into ... These exposures can alter the circuit board laminate material properties thereby creating a shift in the expected anbsp;...
|Title||:||Characterization of FR-4 Printed Circuit Board Laminates Before and After Exposure to Lead-free Soldering Conditions|
|Publisher||:||ProQuest - 2008|