Tummala, R. R, Fundamentals of Microsystems Packaging, McGraw-Hill New York, NY, 2001 . 14. ... ANSYS User S Manual, Revision 5.6. ... APPENDIX: 2D VS 3D SOLUTIONS The objective of this appendix is to show that the current 2D plane-strain simulations are adequate for the purpose of this study, i.e., to compare theanbsp;...
|Title||:||Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology|