A laborious manual search and disassemble of single defect contacts is unnecessary. Data aquisition has been done with a Windows NTPCSystem configured with a Labview-Software. Resistivities have been measured with a Keithley 2010anbsp;...
|Title||:||Electronics Packaging Technology Conference, 2002. 4th|
|Author||:||Charles Lee, Kok Chuan Toh, Mahadevan K. Iyer|
|Publisher||:||IEEE Standards Office - 2002|