Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the developmentThe phase diagram is used to identify eutectic solders and their solidus/liquidus point. PHOTO ... PIGTAIL: A term that describes the amount of excess wire that remains at a bond site beyond the bond. ... PLATED THROUGH HOLE: A hole with a plated wall used for electrical interconnection between internal and/or externalanbsp;...
|Title||:||Handbook of Electronic Package Design|
|Publisher||:||CRC Press - 1991-08-16|