Ultrasonic vibrations were excited into standard 8aquot; wafers using an external ultrasonic transducer and their amplitude recorded in a ... Residual elastic stress can also be harmful for silicon substrates, especially with scaling of a wafer diameter up to 12. ... EXPERIMENTAL Ultrasonic vibrations were generated into single-side polished Cz-Si wafers 660 Electrochemical Society Proceedings Volume 2000-17.
|Title||:||High Purity Silicon VI|
|Author||:||Cor L. Claeys|
|Publisher||:||The Electrochemical Society - 2000-01-01|