Sinteticheskiye Almazy 1975 (4) pp 29-30 In Russian Describes new designs of diamond annular blades for slicing or cutting semiconductor materials and also other hard materials such ... The grinding temperatures for different cases are illustrated in the form of diagrams. ... 1973) Machine for cutting brittle materials by means of a wire and abrasive suspension. ... N93 FP 2, 254, 949 Motorola Inc ( Dec 18.
|Title||:||IDR. Industrial Diamond Review|