This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.For example, the x-y wiring and z-direction TSV, silicon-silicon interconnections, and vertical buses through multiple ... to 3 I¼m and different signal-to-ground structures showed that open-eye diagrams could be obtained for frequencies from 3anbsp;...
|Title||:||Integrated Interconnect Technologies for 3D Nanoelectronic Systems|
|Author||:||Muhannad S. Bakir, James D. Meindl|
|Publisher||:||Artech House - 2008-11-30|