MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).High accuracy timing measurements verify the AC parametrics such as setup and hold times. ... These chips require tremendous amounts of manual test vector generation, with much of the simulation modeling done on the fly. ... MCMs are packages containing more than one IC and perhaps many passive analog components such as resistors and capacitors. ... be lowcost with low chip-count so that die and assembly yields do not contribute significantly to overall production costs.
|Title||:||Multi-Chip Module Test Strategies|
|Publisher||:||Springer Science & Business Media - 2012-12-06|