RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.BasicDoc= MIL-STD-883 Aihara, K., Pham, A.: Development of ... 38, 120a122, 1995 Agilent Advanced Design Sysa#39;tem (ADS) [Online.] ... .dscc.dla.mil/ Downloads/MilSpec/Docs/MIL-STD-883/std883 .pdf HYPERTEXT:http://www. jedec.org/ HYPERTEXT: http://www.endwave.com HYPERTEXT: http://www.hittite .com/HMC564anbsp;...
|Title||:||RF and Microwave Microelectronics Packaging|
|Author||:||Ken Kuang, Franklin Kim, Sean S. Cahill|
|Publisher||:||Springer Science & Business Media - 2009-12-01|