The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in qAssembly Engineeringq and qElectronic Packaging and Productionq, will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.100K Total 730K (Source: Tektronix) SMT production-line equipment costs quirements, both current and future, must be ... automation and factory integration , especially from the standpoint of off-line programming and CAD data download. ... A manual placement capability should also be maintained for backup and repair.
|Title||:||The Electronics Assembly Handbook|
|Author||:||Frank Riley, Electronic Packaging and Production|
|Publisher||:||Springer Science & Business Media - 2013-06-29|