The symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain engineering, and hybrid integration.These include; load dump, reverse battery, and short to battery protection. ... Background When a reverse battery fault is encountered, as in the case of either connecting a car battery or jumper cables incorrectly, the power and ground lines areanbsp;...
|Title||:||ULSI Process Integration 5|
|Author||:||Cor L. Claeys|
|Publisher||:||The Electrochemical Society - 2007-01-01|